Precision-engineered for superior mechanical strength and thermal conductivity, SiC Bulk materials are ideal for machining into high performance components in harsh environments such as semiconductor processing and high temperature reactors.
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Our SiC Susceptor delivers excellent heat uniformity and thermal stability, making them perfect for epitaxial growth process and MOCVD equipment in semiconductor manufacturing.
This project outlines the precision manufacturing process of transforming a 152mm diameter by 22mm thick SiC bulk into a convex lens. The final component can be fabricated to custom diameter and thickness specifications, featuring a precisely crafted radius of curvature tailored to application requirements.
Our optimized SiC powder morphology enables highly precise 3D printed models with intricate geometries beyond the reach of traditional machining. This allows for complex, near-net-shape components that retain Silicon Carbide's signature hardness and thermal stability.
Our high purity SiC Ring offers exceptional thermal conductivity and longevity, helping to maintain the uniformity in the semiconductor manufacturing process.
Designed for the use in Inductively Coupled Plasma (ICP) etching systems, our SiC trays offer exceptional resistance to plasma, corrosion, and thermal stress, ensuring stable performance and long service life.
High hardness and wear resistance make our SiC Mill Components suitable for ultra pure, abrasive material handling in chemical and powder processing industries.
| Composition | High Purity (5N) Polycrystalline SiC |
| Maximum Part Size | Dimension: Φ510mm/ Thickness: 1~30mm |
| Corrosion Resistance | Excellent Resistance to Hydrofluoric Acid, Ions, and Plasma |
| Maximum Operating Temperature | In Vacuum : Below 1600℃ |
| Application | High Purity Semiconductor parts/ Heat resistant parts/ Sliding parts/ Abrasion resistant parts |
| Characteristics | Units | Value | Measuring Methods |
|---|---|---|---|
| Density | g/cm3 | 3 | Archimedes' Method |
| Vickers Hardness | kgf/mm2 | 2000 | Vickers Hardness Test |
| Bending Strength | MPa | 600 | 3-Point Bending Test |
| Modulus of Elasticity | GPa | 350 | Tension/Compression Test |
| Fracture Toughness | MPa/m0.5 | 3 | ASTM C849 |
| Coefficient of Thermal Expansion, 25°C | 10-6/K | 4 | ASTM D696 |
| Thermal Conductivity | W/m·K | 250 | Laser Flash Method (RT) |
| Volume Resistivity | Ω·cm | ≥1×104 | 4-Points Probe Method (RT) |
